1 June 2024

NQCP Team Up with NYU to Advance Quantum Material Research

Annoucement

We have embarked on a collaborative effort with New York University’s Center for Quantum Information Physics (CQIP), to develop superconductor and semiconductor materials. These materials have the potential to significantly enhance the performance of electronics, quantum sensors, and computing capabilities in the manufacturing sector.

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Under this new collaboration, we, as part of the Niels Bohr Institute, and CQIP will explore the viability of superconductor-semiconductor quantum materials. 

“Our mission at NQCP is to enable the development of fault-tolerant quantum computing for life sciences. As part of this program, we are investigating various approaches to constructing quantum processor hardware,” stated Professor Peter Krogstrup, CEO of NQCP and a University of Copenhagen faculty member. “One promising direction for compact and high-speed quantum processing lies in hybrid semiconductor-superconductor materials. We are excited to collaborate with CQIP, where the team has extensive experience in researching these hybrid systems.” 

We are thrilled to join forces with our colleagues at NQCP to study semiconductor and superconductor materials development, providing a direct path for the production of quantum chips.

  Professor Javad Shabani, Director of CQIP at NYU.

The realization of quantum computing's promise has been elusive. In solid-state platforms, which are based solely on semiconductors, one challenge is incorporating superconductivity—energy-efficient electricity transmission—into semiconductors, the foundational elements of today’s electronic devices. 

The successful development of superconductor-semiconductor quantum materials could revolutionize computing by speeding up calculations, creating new quantum circuit functionalities, and finding ways to integrate these advancements with complementary metal-oxide-semiconductor (CMOS) processes. These processes are crucial in building energy-efficient microprocessors, memory chips, image sensors, and other technologies. 

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